APA (7. basım) Alıntı

Cheng, J. (2018). Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect (1st ed. 2018.). Springer Nature Singapore. https://doi.org/10.1007/978-981-10-6165-3

Chicago Style (17. basım) Atıf

Cheng, Jie. Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect. 1st ed. 2018. Singapore: Springer Nature Singapore, 2018. https://doi.org/10.1007/978-981-10-6165-3.

MLA (9th ed.) Atıf

Cheng, Jie. Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect. 1st ed. 2018. Springer Nature Singapore, 2018. https://doi.org/10.1007/978-981-10-6165-3.