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Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorro...
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| Format: | e-Book |
| Language: | English |
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Singapore :
Springer Nature Singapore : Imprint: Springer,
2018.
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| Edition: | 1st ed. 2018. |
| Series: | Springer Theses, Recognizing Outstanding Ph.D. Research,
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| Online Access: | Full-text access View in OPAC |