RF and Microwave Microelectronics Packaging II

Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers T...

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Detaylı Bibliyografya
Müşterek Yazar: SpringerLink (Online service)
Diğer Yazarlar: Kuang, Ken (Editör), Sturdivant, Rick (Editör)
Materyal Türü: e-Kitap
Dil:İngilizce
Baskı/Yayın Bilgisi: Cham : Springer International Publishing : 2017.
Imprint: Springer,
Edisyon:1st ed. 2017.
Konular:
Electronics.
Telecommunication.
Electronic circuits.
Electronics and Microelectronics, Instrumentation.
Microwaves, RF Engineering and Optical Communications.
Electronic Circuits and Systems.
Online Erişim:Full-text access

Internet

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