APA (7. basım) Alıntı

SpringerLink (Online service), Kuang, K., & Sturdivant, R. (2017). RF and Microwave Microelectronics Packaging II (1st ed. 2017.). Springer International Publishing. https://doi.org/10.1007/978-3-319-51697-4

Chicago Style (17. basım) Atıf

SpringerLink (Online service), Ken Kuang, ve Rick Sturdivant. RF and Microwave Microelectronics Packaging II. 1st ed. 2017. Cham: Springer International Publishing, 2017. https://doi.org/10.1007/978-3-319-51697-4.

MLA (9th ed.) Atıf

SpringerLink (Online service), et al. RF and Microwave Microelectronics Packaging II. 1st ed. 2017. Springer International Publishing, 2017. https://doi.org/10.1007/978-3-319-51697-4.