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RF and Microwave Microelectronics Packaging II
Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers T...
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| Diğer Yazarlar: | , |
| Materyal Türü: | e-Kitap |
| Dil: | İngilizce |
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Cham :
Springer International Publishing :
2017.
Imprint: Springer, |
| Edisyon: | 1st ed. 2017. |
| Konular: | |
| Online Erişim: | Full-text access |
| Özet: | Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics. |
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| Fiziksel Özellikler: | XII, 172 p. 127 illus., 77 illus. in color. online resource. |
| ISBN: | 9783319516974 |
| DOI: | 10.1007/978-3-319-51697-4 |