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RF and Microwave Microelectronics Packaging II

Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers T...

Detaylı Bibliyografya
Müşterek Yazar:	SpringerLink (Online service)
Diğer Yazarlar:	Kuang, Ken (Editör), Sturdivant, Rick (Editör)
Materyal Türü:	e-Kitap
Dil:	İngilizce
Baskı/Yayın Bilgisi:	Cham : Springer International Publishing : Imprint: Springer, 2017.
Edisyon:	1st ed. 2017.
Konular:	Electronics. Telecommunication. Electronic circuits. Electronics and Microelectronics, Instrumentation. Microwaves, RF Engineering and Optical Communications. Electronic Circuits and Systems.
Online Erişim:	Full-text access OPAC'ta görüntüle

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