RF and Microwave Microelectronics Packaging II

Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers T...

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Detaylı Bibliyografya
Müşterek Yazar: SpringerLink (Online service)
Diğer Yazarlar: Kuang, Ken (Editör), Sturdivant, Rick (Editör)
Materyal Türü: e-Kitap
Dil:İngilizce
Baskı/Yayın Bilgisi: Cham : Springer International Publishing : 2017.
Imprint: Springer,
Edisyon:1st ed. 2017.
Konular:
Electronics.
Telecommunication.
Electronic circuits.
Electronics and Microelectronics, Instrumentation.
Microwaves, RF Engineering and Optical Communications.
Electronic Circuits and Systems.
Online Erişim:Full-text access
İçindekiler:
  • Chapter1. Introduction to RF and Microwave Microelectronic Packaging
  • Chapter2. Packaging of Transmit/Receive Modules
  • Chapter3. 3D Transitions and Connections
  • Chapter4. Electromagnetic Shielding for RF & Microwave Packages
  • Chapter5. Design of C-Band Interdigital Filter and Compact C-band Hairpin Bandpass Film Filter on Thin Film Substrate
  • Chapter6. Research on High-reliable Low-loss HTCC Technology Applied in Millimeter Wave SMT Package
  • Chapter7. Chip Size Packaging (CSP) for RF MEMS Devices
  • Chapter8. The challenge in packaging and assembly the advanced power amplifiers
  • Chapter9. High Thermal Conductivity Materials - Aluminum Diamond, Aluminum Silicon Carbide, and Copper Diamond
  • Chapter10. Advancement in High Thermal Conductive Graphite for Microelectronic Packaging
  • Chapter11. Carbon nanotubes and graphene for microwave/RF electronics packaging.

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