Testing of Interposer-Based 2.5D Integrated Circuits

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer,...

Ful tanımlama

Detaylı Bibliyografya
Asıl Yazarlar: Wang, Ran (Yazar), Chakrabarty, Krishnendu (Yazar)
Müşterek Yazar: SpringerLink (Online service)
Materyal Türü: e-Kitap
Dil:İngilizce
Baskı/Yayın Bilgisi: Cham : Springer International Publishing : 2017.
Imprint: Springer,
Edisyon:1st ed. 2017.
Konular:
Electronic circuits.
Microprocessors.
Computer architecture.
Logic design.
Electronic Circuits and Systems.
Processor Architectures.
Logic Design.
Online Erişim:Full-text access

Internet

Full-text access

Merkez Kütüphane

Detaylı Erişim Bilgileri Merkez Kütüphane
Kopya Bilgisi UnknownBarcode

Benzer Materyaller