Testing of Interposer-Based 2.5D Integrated Circuits

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer,...

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Bibliographic Details
Main Authors: Wang, Ran (Author), Chakrabarty, Krishnendu (Author)
Corporate Author: SpringerLink (Online service)
Format: e-Book
Language:English
Published: Cham : Springer International Publishing : Imprint: Springer, 2017.
Edition:1st ed. 2017.
Subjects:
Electronic circuits.
Microprocessors.
Computer architecture.
Logic design.
Electronic Circuits and Systems.
Processor Architectures.
Logic Design.
Online Access:Full-text access
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Table of Contents:
  • Introduction
  • Pre-Bond Testing of the Silicon Interposer
  • Post-Bond Scan-based Testing of Interposer Interconnects
  • Test Architecture and Test-Path Scheduling
  • Built-In Self-Test
  • ExTest Scheduling and Optimization
  • A Programmable Method for Low-Power Scan Shift in SoC Dies
  • Conclusions.-.

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