Advances in Thin Films, Nanostructured Materials, and Coatings Selected Papers from the 2018 International Conference on "Nanomaterials: Applications & Properties" /

This book highlights the latest advances in chemical and physical methods for thin-film deposition and surface engineering, including ion- and plasma-assisted processes, focusing on explaining the synthesis/processing-structure-properties relationship for a variety of thin-film systems. It covers to...

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Detaylı Bibliyografya
Müşterek Yazar: SpringerLink (Online service)
Diğer Yazarlar: Pogrebnjak, Alexander D. (Editör), Novosad, Valentine (Editör)
Materyal Türü: e-Kitap
Dil:İngilizce
Baskı/Yayın Bilgisi: Singapore : Springer Nature Singapore : Imprint: Springer, 2019.
Edisyon:1st ed. 2019.
Seri Bilgileri:Lecture Notes in Mechanical Engineering,
Konular:
Surfaces (Technology).
Thin films.
Microtechnology.
Microelectromechanical systems.
Surfaces (Physics).
Nanochemistry.
Materials > Analysis.
Materials.
Surfaces, Interfaces and Thin Film.
Microsystems and MEMS.
Surface and Interface and Thin Film.
Characterization and Analytical Technique.
Materials Engineering.
Online Erişim:Full-text access
OPAC'ta görüntüle
Diğer Bilgiler
Özet:This book highlights the latest advances in chemical and physical methods for thin-film deposition and surface engineering, including ion- and plasma-assisted processes, focusing on explaining the synthesis/processing-structure-properties relationship for a variety of thin-film systems. It covers topics such as advances in thin-film synthesis; new thin-film materials: diamond-like films, granular alloys, high-entropy alloys, oxynitrides, and intermetallic compounds; ultra-hard, wear- and oxidation-resistant and multifunctional coatings; superconducting, magnetic, semiconducting, and dielectric films; electrochemical and electroless depositions; thin-film characterization and instrumentation; and industrial applications.
Fiziksel Özellikler:XI, 386 p. 212 illus., 125 illus. in color. online resource.
ISBN:9789811361333
ISSN:2195-4364
DOI:10.1007/978-981-13-6133-3

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