APA (7. basım) Alıntı

Tong, X. C. (2011). Advanced materials for thermal management of electronic packaging. Springer.

Chicago Style (17. basım) Atıf

Tong, Xingcun Colin. Advanced Materials for Thermal Management of Electronic Packaging. New York ; London: Springer, 2011.

MLA (9th ed.) Atıf

Tong, Xingcun Colin. Advanced Materials for Thermal Management of Electronic Packaging. Springer, 2011.