Tong, X. C. (2011). Advanced materials for thermal management of electronic packaging. Springer.
Chicago Style (17. basım) AtıfTong, Xingcun Colin. Advanced Materials for Thermal Management of Electronic Packaging. New York ; London: Springer, 2011.
MLA (9th ed.) AtıfTong, Xingcun Colin. Advanced Materials for Thermal Management of Electronic Packaging. Springer, 2011.
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