Advanced materials for thermal management of electronic packaging /

Bibliographic Details
Main Author: Tong, Xingcun Colin
Format: Book
Language:English
Published: New York ; London : Springer, 2011.
Series:Springer series in advanced microelectronics.
Subjects:
Electronic apparatus and appliances > Temperature control.
Elektronik cihazlar ve aletler > Sıcaklık kontrolü.
Electronic packaging > Materials.
Elektronik paketleme > Malzemeleri.
Online Access:View in OPAC
Description
Item Description:Dizin : 607-616 s.
Physical Description:xxi, 616 sayfa ; 25 cm.
Bibliography:Kaynakça : 591-593 s.
ISBN:9781441977588

Similar Items