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Materials for Advanced Packaging
This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D p...
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| Other Authors: | , |
| Format: | e-Book |
| Language: | English |
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Cham :
Springer International Publishing : Imprint: Springer,
2017.
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| Edition: | 2nd ed. 2017. |
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| Online Access: | Full-text access View in OPAC |