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Materials for Advanced Packaging
This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D p...
Müşterek Yazar: | SpringerLink (Online service) |
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Diğer Yazarlar: | Lu, Daniel (Editör), Wong, C.P (Editör) |
Materyal Türü: | e-Kitap |
Dil: | İngilizce |
Baskı/Yayın Bilgisi: |
Cham :
Springer International Publishing :
2017.
Imprint: Springer, |
Edisyon: | 2nd ed. 2017. |
Konular: | |
Online Erişim: | Full-text access |
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