Materials for Advanced Packaging

This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D p...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Lu, Daniel (Editor), Wong, C.P (Editor)
Format: e-Book
Language:English
Published: Cham : Springer International Publishing : Imprint: Springer, 2017.
Edition:2nd ed. 2017.
Subjects:
Electronics.
Microtechnology.
Microelectromechanical systems.
Metals.
Optical materials.
Electronic circuits.
Electronics and Microelectronics, Instrumentation.
Microsystems and MEMS.
Metals and Alloys.
Optical Materials.
Electronic Circuits and Systems.
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