Die-Attach Materials for High Temperature Applications in Microelectronics Packaging Materials, Processes, Equipment, and Reliability /

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Siow, Kim S. (Editor)
Format: e-Book
Language:English
Published: Cham : Springer International Publishing : Imprint: Springer, 2019.
Edition:1st ed. 2019.
Subjects:
Optical materials.
Electronics.
Metals.
Materials > Analysis.
Materials.
Security systems.
Optical Materials.
Electronics and Microelectronics, Instrumentation.
Metals and Alloys.
Characterization and Analytical Technique.
Materials Engineering.
Security Science and Technology.
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