3D Microelectronic Packaging From Fundamentals to Applications /

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Li, Yan (Editor), Goyal, Deepak (Editor)
Format: e-Book
Language:English
Published: Cham : Springer International Publishing : 2017.
Imprint: Springer,
Edition:1st ed. 2017.
Series:Springer Series in Advanced Microelectronics, 57
Subjects:
Electronics.
Optical materials.
Electronic circuits.
Microtechnology.
Microelectromechanical systems.
Metals.
Electronics and Microelectronics, Instrumentation.
Optical Materials.
Electronic Circuits and Systems.
Microsystems and MEMS.
Metals and Alloys.
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