Carbon Nanotubes for Interconnects Process, Design and Applications /

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in o...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Todri-Sanial, Aida (Editor), Dijon, Jean (Editor), Maffucci, Antonio (Editor)
Format: e-Book
Language:English
Published: Cham : Springer International Publishing : 2017.
Imprint: Springer,
Edition:1st ed. 2017.
Subjects:
Electronic circuits.
Microprocessors.
Computer architecture.
Electronic Circuits and Systems.
Processor Architectures.
Online Access:Full-text access

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