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RF and Microwave Microelectronics Packaging II
Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers T...
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| Other Authors: | , |
| Format: | e-Book |
| Language: | English |
| Published: |
Cham :
Springer International Publishing :
2017.
Imprint: Springer, |
| Edition: | 1st ed. 2017. |
| Subjects: | |
| Online Access: | Full-text access |