RF and Microwave Microelectronics Packaging II

Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers T...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Kuang, Ken (Editor), Sturdivant, Rick (Editor)
Format: e-Book
Language:English
Published: Cham : Springer International Publishing : 2017.
Imprint: Springer,
Edition:1st ed. 2017.
Subjects:
Electronics.
Telecommunication.
Electronic circuits.
Electronics and Microelectronics, Instrumentation.
Microwaves, RF Engineering and Optical Communications.
Electronic Circuits and Systems.
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