Advanced materials for thermal management of electronic packaging /

Bibliographic Details
Main Author: Tong, Xingcun Colin
Format: Book
Language:English
Published: New York ; London : Springer, 2011.
Series:Springer series in advanced microelectronics.
Subjects:
Electronic apparatus and appliances > Temperature control.
Elektronik cihazlar ve aletler > Sıcaklık kontrolü.
Electronic packaging > Materials.
Elektronik paketleme > Malzemeleri.

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